Bold Laser Automation 推出 LPC1010CO2 激光精密切割与钻孔平台
New CO2 Laser Cutting and Drilling Platform Enhances PCB and Electronic Materials Manufacturing
Bold Laser Automation 推出 LPC1010CO2 激光精密切割与钻孔平台，面向 PCB、柔性电路及先进电子材料的精密钻孔、切槽、切割、修边和选择性去材。该平台基于公司 PCP1100 Laser Printed Circuit Processor 架构，整合精密运动控制、机器视觉与激光加工。系统可处理介质层、聚酰亚胺、FR4、陶瓷和铁氧体材料，支持钻孔、铣削、修边、单件分离和切槽。核心为高峰值功率 CO2 激光，配高分辨率聚焦系统和旋切光学，可加工小于 22 微米的特征尺寸；精密 X-Y-Z 运动平台定位分辨率达 1 微米。平台支持 DXF 和 Excellon 钻孔文件等 CAD/CAM 工作流，并采用全封闭 Class 1 激光安全防护罩，工业级门机构额定运行超过 100,000 次。
Bold Laser Automation has introduced the LPC1010CO2 Laser Precision Cutting and Drilling Platform, a high-performance manufacturing system designed for precision drilling, skiving, cutting, trimming, and selective material removal in printed circuit board (PCB), flex circuit, and advanced electronic material applications.
Built on the company’s PCP1100 Laser Printed Circuit Processor architecture, the system combines precision motion control, advanced machine vision, and optimized laser processing to deliver high-quality results in demanding production environments.
The platform is engineered for manufacturers seeking to improve throughput, reduce process variation, and increase yield in next-generation electronic packaging and circuit fabrication applications.
Material Processing and Precision
The LPC1010CO2 is designed to process a variety of materials commonly used in electronics manufacturing, including dielectrics, polyimide, FR4, ceramics, and ferrite materials, while supporting applications that require precise drilling, milling, trimming, singulation, and skiving operations.
At the heart of the platform is a high-peak power CO2 laser integrated with a high-resolution focusing system and trepanning optics capable of producing feature sizes below 22 microns. Combined with precision X-Y-Z motion stages featuring one-micron positioning resolution, the system provides exceptional accuracy and repeatability for critical manufacturing processes.
“One of the biggest challenges in precision manufacturing is maintaining accuracy without slowing production down. By combining inline vision and automated alignment, we're helping customers hold tight tolerances while reducing the amount of operator intervention required,” explained Todd E. Lizotte, CEO and Co-founder of Bold Laser Automation.
Workflow and Process Stability
The platform supports industry-standard CAD/CAM workflows, including DXF and Excellon drill file formats, allowing users to transition efficiently from design to production. Advanced motion control software and optimized drilling algorithms further enhance productivity by delivering consistent process execution across complex part geometries.
“We've learned over the years that process stability doesn't stop at the laser. Proper cooling and effective debris removal play a major role in maintaining performance, reducing downtime, and helping customers get consistent results day after day,” added Lizotte.
Safety and Durability
Operator safety and industrial durability were key design priorities. The LPC1010CO2 features a fully enclosed Class 1 laser safety enclosure and industrial-grade door mechanisms rated for more than 100,000 operating cycles, supporting continuous use in production environments.
“Manufacturers are under constant pressure to improve yield, increase throughput, and process increasingly complex materials,” said Lizotte. “Our goal was to give customers a robust, production-ready platform that combines precision laser processing, automation, and process control in a single system.”
来源：Industrial Machinery Digest · 金属加工订阅 · industrialmachinerydigest.com